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| DATA SHEET GaAs INTEGRATED CIRCUIT PG2408TB 0.05 to 3.0 GHz SPDT SWITCH DESCRIPTION The PG2408TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for 2.4 GHz wireless LAN, mobile phone and other L, S-band applications. This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies from 0.05 to 3.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density surface mounting. FEATURES * Switch control voltage * Low insertion loss * High isolation * Handling power : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. : Lins = 0.40 dB TYP. @ f = 1.0 GHz : Lins = 0.50 dB TYP. @ f = 2.5 GHz : ISL = 27 dB TYP. @ f = 1.0 GHz : ISL = 18 dB TYP. @ f = 2.5 GHz : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz * High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 x 1.25 x 0.9 mm) APPLICATIONS * L, S-band digital cellular or cordless telephone * W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number Order Number Package 6-pin super minimold (SC-88/SOT-363 type) (Pb-Free) Marking G5P Supplying Form * Embossed tape 8 mm wide * Pin 4, 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel PG2408TB-E4 PG2408TB-E4-A Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PG2408TB Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10770EJ01V0DS (1st edition) Date Published July 2009 NS Printed in Japan 2009 PG2408TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) RF1 1 2 3 6 5 4 1 GND 2 RF2 3 Vcont2 4 4 3 (Top View) Vcont1 6 RFC 5 5 6 (Bottom View) 1 2 Pin No. 1 2 3 4 5 6 Pin Name RF1 GND RF2 Vcont2 RFC Vcont1 SW TRUTH TABLE ON Path RFC-RF1 RFC-RF2 Vcont1 Low High Vcont2 High Low ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature Symbol Vcont Pin TA Tstg Ratings +6.0 Note Note Vcont1 - Vcont2 6.0 V RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) Parameter Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Control Voltage Difference Symbol f Vcont (H) Vcont (L) MIN. 0.05 2.5 -0.2 -0.1 TYP. - 3.0 0 0 MAX. 3.0 5.3 0.2 0.1 Unit GHz V V V Note Vcont (H) = Vcont1 (H) - Vcont2 (H) Vcont (L) = Vcont1 (L) - Vcont2 (L) G5P Unit V dBm C C +33.0 -45 to +85 -55 to +150 Vcont (H), Vcont (L)Note 2 Data Sheet PG10770EJ01V0DS PG2408TB ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Insertion Loss 5 Isolation 1 Isolation 2 Isolation 3 Isolation 4 Isolation 5 Input Return Loss 1 Input Return Loss 2 Output Return Loss 1 Output Return Loss 2 0.1 dB Loss Compression Input Power Note 2 Symbol Lins1 Lins2 Lins3 Lins4 Lins5 ISL1 ISL2 ISL3 ISL4 ISL5 RLin1 RLin2 RLout1 RLout2 Pin (0.1 dB) Test Conditions f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz Note 1 Note 1 Note 1 Note 1 MIN. - - - - - 24 24 16 15 14 15 15 15 15 +27.0 - - - - TYP. 0.40 0.40 0.48 0.50 0.56 27 27 19 18 17 20 20 20 20 +29.0 +29.0 +60 MAX. 0.55 0.55 0.63 0.65 0.70 - - - - - - - - - - - - Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm Input 3rd Order Intercept Point IIP3 f = 0.5 to 3.0 GHz, 2 tone, 5 MHz spicing Switch Control Current Switch Control Speed Icont tSW No RF input 50% CTL to 90/10% RF 0.3 50 20 500 A ns Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1 000pF for frequencies above 0.5 GHz. Data Sheet PG10770EJ01V0DS 3 PG2408TB EVALUATION CIRCUIT C2 C1 RF1 1 Vcont1 6 2 RFC 5 3 C1 Note Vcont2 RF2 C1 4 C2 Note C1 : 0.05 to 0.5 GHz : 0.5 to 3.0 GHz C2 : 1 000 pF 1 000 pF 56 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 C1 LESD * LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. * The value may be tailored to provide specific electrical responses. * The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. 4 Data Sheet PG10770EJ01V0DS PG2408TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont1 RF1 C 1 C 2 C1 C2 C 1 RF2 USING THE NEC EVALUATION BOARD Symbol C1 Test Conditions f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz C2 Values 1 000 pF 56 pF 1 000 pF Data Sheet PG10770EJ01V0DS IN Vc1 Vc2 C1 6pin SMM SPDT SW C2 C2 C1 G5P C1 OUT 2 OUT 1 RFC Vcont2 5 PG2408TB TYPICAL CHARACTERISTICS (TA = +25C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY -0.1 Vcont (H) = 3.0 V Insertion Loss Lins (dB) RFC-RF1/RF2 ISOLATION vs. FREQUENCY 0 Vcont (H) = 3.0 V -5 Isolation ISL (dB) -0.2 -10 -15 -20 -25 -30 -0.3 -0.4 -0.5 -35 -0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INPUT RETURN LOSS vs. FREQUENCY 0 Input Return Loss RLin (dB) RFC-RF1/RF2 OUTPUT RETURN LOSS vs. FREQUENCY 0 Output Return Loss RLout (dB) Vcont (H) = 3.0 V -5 -10 -15 -20 -25 -30 0.0 Vcont (H) = 3.0 V -5 -10 -15 -20 -25 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) -0.2 -0.3 Insertion Loss Lins (dB) RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) 0 f = 2.5 GHz -5 Isolation ISL (dB) 6 5 4 Lins 3 2 Icont 1 0 5.0 Switch Control Current Icont (A) f = 2.5 GHz Icont: No RF Input -10 -15 -20 -25 -30 -35 -40 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -0.4 -0.5 -0.6 -0.7 -0.8 2.0 2.5 3.0 3.5 4.0 4.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10770EJ01V0DS PG2408TB RFC-RF1/RF2 INPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 Output Return Loss RLout (dB) RFC-RF1/RF2 OUTPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 f = 2.5 GHz -5 Input Return Loss RLin (dB) f = 2.5 GHz -10 -15 -20 -25 -30 -35 -40 -45 -50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Switch Control Voltage (H) Vcont (H) (V) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) 36 f = 2.5 GHz 34 Insertion Loss Lins (dB) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 0 -0.5 -1.0 -1.5 -2.0 -2.5 Icont -3.0 15 Lins f = 2.5 GHz Vcont (H) = 3.0 V 6 5 4 3 2 1 0 35 Switch Control Current Icont (A) 32 30 28 26 24 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 25 30 Switch Control Voltage (H) Vcont (H) (V) Input Power Pin (dBm) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) RFC-RF1/RF2 Pin (0.1 dB) vs. FREQUENCY 38 36 34 32 30 28 26 24 22 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 DC blocking capacitors: f = 0.5 to 3.0 GHz 56 pF f < 0.5 GHz 1 000 pF Vcont (H) = 3.0 V Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PG10770EJ01V0DS 7 PG2408TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 0.4 0.8 0.65 0.65 Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 8 Data Sheet PG10770EJ01V0DS 1.9 PG2408TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 2.10.1 1.250.1 2.0+0.15 -0.20 1.3 0.65 0.65 0.1 MIN. 0.90.1 0.7 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 Data Sheet PG10770EJ01V0DS 9 PG2408TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120C or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PG10770EJ01V0DS PG2408TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. * The information in this document is current as of July, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E Data Sheet PG10770EJ01V0DS 11 PG2408TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. |
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